The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Feb. 03, 2017
Applicant:

National Technology & Engineering Solutions of Sandia, Llc, Albuquerque, NM (US);

Inventors:

Christopher Nordquist, Albuquerque, NM (US);

Christopher W. Berry, Mountain View, CA (US);

Peter Lukas Wilhelm Maunz, Albuquerque, NM (US);

Matthew G. Blain, Albuquerque, NM (US);

Jonathan David Sterk, Albuquerque, NM (US);

Paul J. Resnick, Albuquerque, NM (US);

John F. Rembetski, Albuquerque, NM (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/12 (2006.01); G06N 10/00 (2019.01); H01J 49/42 (2006.01);
U.S. Cl.
CPC ...
H01L 29/122 (2013.01); H01J 49/422 (2013.01); G06N 10/00 (2019.01); H01J 49/424 (2013.01);
Abstract

A platform for trapping atomic ions includes a substrate and a plurality of metallization layers that overlie the substrate. The metallization layer farthest from the substrate is a top layer patterned with electrostatic control trap electrodes and radio-frequency trap electrodes. Another metallization layer is a microwave layer patterned to define a microwave circuit. The microwave layer lies below the top layer. The microwave circuit is adapted to generate, in use, a microwave magnetic field above the electrostatic control and radio-frequency trap electrodes. The top metallization layer includes slots that, in use, are penetrated by microwave energy from the microwave circuit.


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