The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Jan. 04, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Yoon Ho Son, Hwaseong-si, KR;

Jae Uk Shin, Suwon-si, KR;

Yong Sun Ko, Suwon-si, KR;

Im Soo Park, Seongnam-si, KR;

Sung Yoon Chung, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10885 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/31111 (2013.01); H01L 21/76816 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 27/10888 (2013.01); H01L 27/10814 (2013.01); H01L 27/10823 (2013.01);
Abstract

Semiconductor devices and methods of forming the same are provided. The methods may include forming first and second line patterns. The first line pattern has a first side facing the second line pattern, and the second line pattern has a second side facing the first line pattern. The methods may also include forming a first spacer structure on the first side of the first line pattern and a second spacer structure on the second side of the second line pattern. The first and the second spacer structures may define an opening. The methods may further include forming a first conductor in a lower part of the opening, forming an expanded opening by etching upper portions of the first and second spacer structures, and forming a second conductor in the expanded opening. The expanded opening may have a width greater than a width of the lower part of the opening.


Find Patent Forward Citations

Loading…