The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Dec. 26, 2016
Applicant:
Fuji Electric Co., Ltd., Kanagawa, JP;
Inventors:
Assignee:
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 27/06 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 29/872 (2006.01); H01L 25/065 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01); H01L 23/049 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/565 (2013.01); H01L 23/24 (2013.01); H01L 23/3135 (2013.01); H01L 23/3178 (2013.01); H01L 25/0655 (2013.01); H01L 29/0619 (2013.01); H01L 29/1608 (2013.01); H01L 29/66143 (2013.01); H01L 29/66333 (2013.01); H01L 29/7395 (2013.01); H01L 29/872 (2013.01); H01L 23/049 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/484 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01);
Abstract
A semiconductor deviceincludes a semiconductor elementhaving an electrode on a front surface, a wirebonded to the electrode of the semiconductor element, a resin layercovering a bonding portion of the wireon the front surface of the semiconductor element, and a gel filler materialthat seals the semiconductor element, the wire, and the resin layer. By protecting the bonding portion of the wirewith the resin layer, degradation of the wireis ameliorated and the reliability of the semiconductor deviceis improved.