The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Dec. 05, 2017
Infineon Technologies Ag, Neubiberg, DE;
Hui Teng Wang, Johor, MY;
Swain Hong Yeo, Singapore, SG;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes a second leadframe assembly stacked above a first leadframe assembly, each leadframe assembly including a die pad, a plurality of leads and a semiconductor die attached to the die pad and electrically connected to the leads. A spacer separates the leadframe assemblies from one another. A single mold compound embeds part of the first leadframe assembly, part of the second leadframe assembly and the spacer. A portion of the leads of both leadframe assemblies are uncovered by the mold compound to form terminals of the semiconductor package. A side of both die pads is uncovered by the mold compound.