The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Jan. 31, 2017
Applicant:

Rockwell Automation Technologies, Inc., Mayfield Heights, OH (US);

Inventors:

Paul Jerome Grosskreuz, West Bend, WI (US);

Rui Zhou, West Bend, WI (US);

Kelly James Bronk, Kewaskum, WI (US);

Jeremiah John Kopiness, Saukville, WI (US);

Assignee:

Rockwell Automation Technologies, Inc., Mayfield Heights, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); F16B 31/02 (2006.01); H01L 21/52 (2006.01); H01L 21/66 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); F16B 31/028 (2013.01); H01L 21/52 (2013.01); H01L 22/26 (2013.01); H01L 23/4275 (2013.01); H01L 23/4338 (2013.01); H01L 23/42 (2013.01); H01L 2023/4068 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A system includes a heat sink, a semiconductor device, a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, and a fastener system that couples the semiconductor device, the layer of TIM, and the heat sink together. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink during operation of the semiconductor device. The fastener system includes a first Belleville-type washer configured to cooperate with the TIM, which flows when heated beyond a threshold temperature, to maintain a substantially constant coupling force between the semiconductor device and the heat sink during operation of the semiconductor device.


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