The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
May. 15, 2018
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Laura May Antoinette Dela Paz Clemente, Antipolo, PH;
Jerry Gomez Cayabyab, Baguio, PH;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/043 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/043 (2013.01); H01L 23/3114 (2013.01); H01L 23/49562 (2013.01);
Abstract
A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.
Clemente, Laura May Antoinette Dela Paz. (2019). Semiconductor device package with a cap to selectively exclude contact with mold compound (U.S. Patent No. 10418294). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10418294
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile