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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10418180 B1

PDFFull Text
Date of Patent:
Sep. 17, 2019

Filed:

Mar. 07, 2017

Electronic component and manufacturing method for the same

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Tomohiro Kageyama, Nagaokakyo, JP;

Tetsuo Kawakami, Nagaokakyo, JP;

Manabu Sakai, Nagaokakyo, JP;

Takashi Ohara, Nagaokakyo, JP;

Takahiro Hirao, Nagaokakyo, JP;

Ryuki Kakuta, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Thomas M Dougherty

Int. Cl.
CPC ...
H01L 41/09 (2006.01); H01L 41/047 (2006.01); H01L 41/083 (2006.01); H01G 4/30 (2006.01); H01F 27/28 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/248 (2006.01); H01L 41/187 (2006.01); H01L 41/293 (2013.01); H01L 41/297 (2013.01); H01C 1/148 (2006.01); H01C 7/18 (2006.01); H01G 4/232 (2006.01); H01C 7/00 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01G 4/308 (2013.01); H01C 1/148 (2013.01); H01C 7/18 (2013.01); H01F 27/2804 (2013.01); H01G 4/012 (2013.01); H01G 4/1245 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H01L 41/0471 (2013.01); H01L 41/0472 (2013.01); H01L 41/1876 (2013.01); H01L 41/293 (2013.01); H01L 41/297 (2013.01); H01C 7/008 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 2027/2809 (2013.01); H01G 4/12 (2013.01);
Abstract

In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

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Kageyama, Tomohiro. (2019). Electronic component and manufacturing method for the same (U.S. Patent No. 10418180). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10418180

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