The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Nov. 07, 2017
Applicant:

Aichi Steel Corporation, Tokai-shi, JP;

Inventor:

Katsuhiko Nishihata, Aichi, JP;

Assignee:

AICHI STEEL CORPORATION, Tokai-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/096 (2016.01); B65H 59/06 (2006.01); H01F 3/06 (2006.01); H01F 41/02 (2006.01); G01R 33/06 (2006.01); H01F 1/153 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 41/096 (2016.01); B65H 59/06 (2013.01); H01F 3/06 (2013.01); H01F 41/0206 (2013.01); B65H 2701/36 (2013.01); G01R 33/063 (2013.01); H01F 1/15391 (2013.01); H01F 41/046 (2013.01);
Abstract

Apparatus for aligning magnetic wire aligns magnetic wires on a wire alignment substrate along its base lines, which are positions the magnetic wires are aligned with, with a small interval and without inducing torsional stresses. A microscope is used to detect misplacement between the base line and a reference line that is the magnetic wire taking a form of a straight line under application of tensile force and pulled out by a wire chuck. The misplacement is corrected using a position adjustment device of a substrate attaching base to which the wire alignment substrate is attached. The magnetic wires are temporarily fixed to the wire alignment substrate by magnetic power, and then permanently fixed to the wire alignment substrate using resin while free from the torsional stresses.


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