The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Aug. 10, 2016
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Shinichiro Banba, Kyoto, JP;

Masaaki Mizushiro, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 17/04 (2006.01); H05K 1/16 (2006.01); H05K 3/24 (2006.01); H01F 17/00 (2006.01); H01F 17/06 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0006 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H05K 1/165 (2013.01); H05K 3/246 (2013.01); H01F 17/0033 (2013.01); H01F 17/06 (2013.01); H01F 27/32 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/086 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/10363 (2013.01); H05K 2203/049 (2013.01);
Abstract

An electronic device includes an insulating layer, a plurality of upper wiring electrode patterns formed on an upper surface of the insulating layer, and a plurality of lower wiring electrode patterns formed on a lower surface of the insulating layer. The upper wiring electrode patterns and the lower wiring electrode patterns each include an underlying electrode layer formed of a conductive paste and a plating electrode layer formed on the underlying electrode layer. With this configuration, the resistivity of the upper and lower wiring electrode patterns and can be made lower than that of the upper and lower wiring electrode patterns and each including only the underlying electrode layer formed of a conductive paste.


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