The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Dec. 13, 2018
Applicant:

Nthdegree Technologies Worldwide Inc., Tempe, AZ (US);

Inventor:

Brian D. Ogonowsky, Mountain View, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G09G 3/32 (2016.01); H01L 23/00 (2006.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/40 (2010.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/58 (2010.01); H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
G09G 3/32 (2013.01); H01L 24/00 (2013.01); H01L 25/0753 (2013.01); H01L 33/0079 (2013.01); H01L 33/0095 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/405 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); G06T 2207/20021 (2013.01); G09G 2300/04 (2013.01); H01L 2224/32225 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0083 (2013.01);
Abstract

Pixel locations in an addressable display are defined by metal landings on a top surface of a flexible substrate, such as by depositing a metal film and etching the film. The substrate surface may be hydrophobic so that the hydrophobic surface is exposed between the metal landings. The substrate has conductive vias that connect the metal landings to traces on a bottom surface of the substrate for connection to addressing circuitry. LED ink is then blanket-printed over the top surface and cured to electrically connect bottom electrodes of the LEDs to the metal landings. LEDs that fall between the landings are ineffective. A dielectric layer is blanket-printed which exposes the top electrodes, and a transparent conductor layer is blanket-printed over the LEDs to connect all LEDs associated with an individual pixel location in parallel. Accordingly, all printed steps can be performed without any alignment.


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