The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Feb. 07, 2017
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Michihito Matsumoto, Chiyoda-ku, JP;

Kazushi Sekine, Chiyoda-ku, JP;

Ichiya Takahashi, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/353 (2006.01); G01F 23/00 (2006.01); G01N 21/41 (2006.01); G02B 6/00 (2006.01); G02B 6/02 (2006.01); G01L 1/24 (2006.01); H01F 5/06 (2006.01); H01F 27/40 (2006.01); H01F 41/12 (2006.01); H02K 3/30 (2006.01); G01N 21/77 (2006.01); H02K 15/12 (2006.01);
U.S. Cl.
CPC ...
G01D 5/353 (2013.01); G01D 5/35316 (2013.01); G01D 5/35377 (2013.01); G01F 23/00 (2013.01); G01L 1/246 (2013.01); G01N 21/41 (2013.01); G01N 21/7743 (2013.01); G02B 6/00 (2013.01); G02B 6/02 (2013.01); H01F 5/06 (2013.01); H01F 27/402 (2013.01); H01F 41/127 (2013.01); H02K 3/30 (2013.01); H02K 15/12 (2013.01);
Abstract

A resin impregnation detection device configured to detect resin impregnation in a resin impregnation process for a coil insulation layer. The resin impregnation detection device can be inserted in a narrow portion, is capable of detecting impregnation with a liquid resin, and does not leave metal foreign materials other than an optical fiber in a product even after the resin impregnation. The resin impregnation detection device includes an optical fiber including an FBG sensor, and a coating resin, which coats the FBG sensor. The coating resin includes a resin to be softened by contact with a detection target resin. The FBG sensor is applied with a compressive strain caused by cure shrinkage of the coating resin or heat shrinkage thereof from a curing temperature to a normal temperature.


Find Patent Forward Citations

Matsumoto, Michihito. (2019). Resin impregnation detection device, coil for rotating machine, and method for impregnating and molding resin of coil for rotating machine (U.S. Patent No. 10416004). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10416004

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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