The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10415900 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 17, 2019

Filed:

Jul. 11, 2014
Applicant:

Westwind Limited, London, GB;

Inventor:

Marcel Riendeau, Shefford, CA;

Assignee:

WESTWIND LIMITED, London, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/18 (2006.01); B23P 15/26 (2006.01); B32B 38/04 (2006.01); F28F 21/08 (2006.01); F28D 21/00 (2006.01); B29C 51/10 (2006.01); B29C 51/26 (2006.01); F28F 3/02 (2006.01); F28F 21/06 (2006.01); B32B 37/12 (2006.01); B32B 38/12 (2006.01); B29C 51/08 (2006.01); B29K 105/00 (2006.01); B29L 31/18 (2006.01); B32B 37/20 (2006.01); B29C 51/14 (2006.01); B29C 51/02 (2006.01); B29C 51/32 (2006.01); B29L 9/00 (2006.01); B32B 38/06 (2006.01);
U.S. Cl.
CPC ...
F28F 13/18 (2013.01); B23P 15/26 (2013.01); B29C 51/105 (2013.01); B29C 51/265 (2013.01); B32B 38/04 (2013.01); F28D 21/0015 (2013.01); F28F 3/02 (2013.01); F28F 21/08 (2013.01); B29C 51/02 (2013.01); B29C 51/082 (2013.01); B29C 51/14 (2013.01); B29C 51/32 (2013.01); B29K 2105/0085 (2013.01); B29K 2105/256 (2013.01); B29L 2009/001 (2013.01); B29L 2031/18 (2013.01); B32B 37/12 (2013.01); B32B 37/203 (2013.01); B32B 38/06 (2013.01); B32B 38/12 (2013.01); B32B 2038/047 (2013.01); B32B 2307/724 (2013.01); F28F 21/06 (2013.01); F28F 2255/08 (2013.01); F28F 2275/02 (2013.01); F28F 2275/04 (2013.01); F28F 2275/06 (2013.01);
Abstract

Methods, plate elements and heat/enthalpy exchangers. a) perforating an unformed plate element with defined outer dimensions in any desired area and in any desired dimension; b) covering at least one side of the unformed plate element with a thin polymer film with latent energy exchange characteristics and; c) forming the plate element into a desired shape and a pattern of corrugations and/or embossing. The operations b) and c) may be performed in a different order. For instance, when the plate element is made out of plastic, b) may be performed before c) whereas, when the plate element is made out of aluminum (or plastic), c) may be performed before b). Operations a) and/or b) and/or c) may also, in certain embodiments, be combined.


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