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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10414957 B1

PDFFull Text
Date of Patent:
Sep. 17, 2019

Filed:

Mar. 16, 2016

Low application temperature hot melt adhesive composition

Applicant:

H.b. Fuller Company, St. Paul, MN (US);

Inventors:

Ameara S. Mansour, Woodbury, MN (US);

Kevin P. Davis, Woodbury, MN (US);

David B. Malcolm, Maplewood, MN (US);

Mark S. Kroll, Arden Hills, MN (US);

Steven R. Vaughan, Lake Elmo, MN (US);

Timothy W. Roska, Forest Lake, MN (US);

Evan Yuan, Guangzhou, CN;

Assignee:

H.B. Fuller Company, St. Paul, MN (US);

Attorneys:

Kirsten Stone

Kristi Halloran

Primary Examiner:

Jacqueline F Stephens

Int. Cl.
CPC ...
A61F 13/15 (2006.01); C09J 153/02 (2006.01); B32B 7/12 (2006.01); A61L 15/24 (2006.01); A61L 15/58 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/12 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
C09J 153/02 (2013.01); A61L 15/24 (2013.01); A61L 15/58 (2013.01); B32B 7/12 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); C09J 7/387 (2018.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01); B32B 2405/00 (2013.01); B32B 2555/02 (2013.01); C09J 2201/606 (2013.01); C09J 2201/61 (2013.01); C09J 2201/622 (2013.01); C09J 2205/114 (2013.01); C09J 2425/00 (2013.01); C09J 2453/00 (2013.01);
Abstract

This invention claims low application temperature hot melt adhesive compositions including at least about 15% by weight of a first styrene block copolymer with a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 10% by weight.

Find Patent Forward Citations

Mansour, Ameara. (2019). Low application temperature hot melt adhesive composition (U.S. Patent No. 10414957). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10414957

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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