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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10414951 B1

PDFFull Text
Date of Patent:
Sep. 17, 2019

Filed:

Mar. 22, 2018

Temporary bonding material, laminate, method for manufacturing laminate, method for manufacturing device substrate, and method for manufacturing semiconductor device

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Kei Fukuhara, Haibara-gun, JP;

Yoshitaka Kamochi, Haibara-gun, JP;

Mitsuru Sawano, Haibara-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Peter D Mulcahy

Int. Cl.
CPC ...
C09J 11/06 (2006.01); B32B 7/12 (2006.01); C09J 201/00 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); C09J 133/10 (2006.01); C09J 171/00 (2006.01); C09J 175/04 (2006.01); H01L 21/768 (2006.01); C09J 175/16 (2006.01); B32B 43/00 (2006.01); C08K 5/5419 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
C09J 11/06 (2013.01); B32B 7/12 (2013.01); C09J 133/10 (2013.01); C09J 171/00 (2013.01); C09J 175/04 (2013.01); C09J 175/16 (2013.01); C09J 201/00 (2013.01); H01L 21/304 (2013.01); H01L 21/683 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/76898 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); B32B 2250/02 (2013.01); B32B 2255/26 (2013.01); B32B 2457/14 (2013.01); C08G 2650/56 (2013.01); C08K 5/5419 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01);
Abstract

Provided are a temporary bonding material which is less likely to cause film unevenness and void formation while maintaining an adhesive force required for temporary bonding of a carrier substrate and a base material, and is easily peelable, a laminate, a method for manufacturing a laminate, a method for manufacturing a device substrate, and a method for manufacturing a semiconductor device. A temporary bonding material of the present invention includes a thermoplastic resin, a compound having a Si—O structure in an amount of 0.001% by mass or more and less than 8% by mass of the thermoplastic resin, and a solvent, in which an adhesive force of the temporary bonding material of an adhesive in which the solvent is removed from the temporary bonding material with respect to a silicon wafer is 1 to 15 N/m. In addition, a laminate using the temporary bonding material, a method for manufacturing a laminate, a method for manufacturing a device substrate, and a method for manufacturing a semiconductor device are disclosed.

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