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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10414869 B1

PDFFull Text
Date of Patent:
Sep. 17, 2019

Filed:

Apr. 08, 2014

Laminite, and element comprising substrate manufactured using same

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hye Won Jeong, Daejeon, KR;

Kyungjun Kim, Daejeon, KR;

Kyoung Hoon Kim, Daejeon, KR;

Chan Hyo Park, Daejeon, KR;

BoRa Shin, Daejeon, KR;

Seung Yup Lee, Daejeon, KR;

HangAh Park, Daejeon, KR;

JinHo Lee, Daejeon, KR;

MiRa Im, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Mark A Osele

Int. Cl.
CPC ...
B32B 43/00 (2006.01); B32B 7/06 (2019.01); C08G 73/10 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 3/16 (2006.01); B32B 7/02 (2019.01); B32B 27/06 (2006.01); C03C 17/34 (2006.01); B32B 17/06 (2006.01); B32B 37/26 (2006.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1067 (2013.01); B32B 3/16 (2013.01); B32B 7/02 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 17/064 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 37/26 (2013.01); B32B 43/006 (2013.01); C03C 17/3405 (2013.01); H01L 31/02 (2013.01); H01L 31/18 (2013.01); H01L 51/0024 (2013.01); H01L 51/0097 (2013.01); H01L 51/52 (2013.01); H01L 51/56 (2013.01); B32B 2037/268 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2255/26 (2013.01); B32B 2307/30 (2013.01); B32B 2307/402 (2013.01); B32B 2307/412 (2013.01); B32B 2307/748 (2013.01); B32B 2379/08 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01); B32B 2457/202 (2013.01); B32B 2457/206 (2013.01); C03C 2218/355 (2013.01); H01L 2221/68318 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); Y10S 156/93 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1195 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/265 (2015.01); Y10T 428/31507 (2015.04); Y10T 428/31533 (2015.04); Y10T 428/31623 (2015.04); Y10T 428/31681 (2015.04); Y10T 428/31721 (2015.04); Y10T 428/31736 (2015.04);
Abstract

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

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