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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10414685 B1

PDFFull Text
Date of Patent:
Sep. 17, 2019

Filed:

Oct. 25, 2017

Substrate processing method

Applicant:

Via Mechanics, Ltd., Kanagawa, JP;

Inventors:

Kenichi Ichikawa, Kanagawa, JP;

Kaori Tateishi, Kanagawa, JP;

Yasushi Ito, Kanagawa, JP;

Assignee:

VIA MECHANICS, LTD., Kanagawa, JP;

Attorneys:

Nixon Peabody LLP

Thomas P. Pavelko

Primary Examiner:

George B Bennett

Int. Cl.
CPC ...
G01B 11/26 (2006.01); C03B 33/10 (2006.01); B25H 7/04 (2006.01); B23K 26/00 (2014.01); B23K 26/035 (2014.01); B23K 26/352 (2014.01); B23K 26/402 (2014.01); B23K 26/382 (2014.01); C03C 17/32 (2006.01); C03C 19/00 (2006.01); B23K 103/00 (2006.01); C03B 33/037 (2006.01); C03B 33/07 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
C03B 33/102 (2013.01); B23K 26/0006 (2013.01); B23K 26/035 (2015.10); B23K 26/352 (2015.10); B23K 26/389 (2015.10); B23K 26/402 (2013.01); B25H 7/04 (2013.01); C03C 17/32 (2013.01); B23K 2103/172 (2018.08); B23K 2103/54 (2018.08); C03B 33/037 (2013.01); C03B 33/074 (2013.01); C03C 19/00 (2013.01); C03C 2218/328 (2013.01);
Abstract

In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

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