The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Mar. 15, 2017
Applicants:

Interface Technology (Chengdu) Co., Ltd., Chengdu, CN;

Interface Optoelectronics (Shenzhen) Co., Ltd., Shenzhen, CN;

General Interface Solution Limited, Miaoli County, TW;

Inventor:

Chin-Yang Wu, Chengdu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2019.01); B32B 27/36 (2006.01); G06F 3/00 (2006.01); B29C 45/14 (2006.01); B29L 31/30 (2006.01); B29K 69/00 (2006.01); B29K 633/04 (2006.01); B29K 669/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B32B 7/02 (2013.01); B29C 45/14811 (2013.01); B32B 27/365 (2013.01); G06F 3/00 (2013.01); B29K 2069/00 (2013.01); B29K 2633/12 (2013.01); B29K 2669/00 (2013.01); B29K 2995/007 (2013.01); B29K 2995/0018 (2013.01); B29L 2031/30 (2013.01); B29L 2031/3475 (2013.01); B32B 2333/12 (2013.01); B32B 2457/208 (2013.01);
Abstract

A low-stress line workpiece and a method for integrally forming the same is disclosed. Firstly, an in-mold injection molding mold is provided, wherein a function film, a 3D curved-surface plastic material, and an anti-rainbow stripe combination layer are placed in the in-mold injection molding mold. The in-mold injection molding mold is used to mold the function film, the plastic material and the combination layer into a low-stress line workpiece integrally formed by in-mold forming. The low-stress line workpiece includes the function film, the plastic layer and the combination layer, wherein the plastic layer is located between the function film and the combination layer. The present invention provides a low-stress line workpiece with high surface hardness and a method for forming the same to reduce lamination fabrication processes and improve lamination yield.


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