The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Aug. 03, 2017
Applicant:
Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan, Guangdong, CN;
Inventors:
Assignee:
Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan, CN;
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/78 (2006.01); B22F 9/20 (2006.01); B21D 39/00 (2006.01); B21C 27/00 (2006.01); B29C 39/10 (2006.01); H04M 1/18 (2006.01); H05K 5/04 (2006.01); B29C 70/74 (2006.01); B29C 39/38 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 65/7808 (2013.01); B22F 9/20 (2013.01); B29C 39/10 (2013.01); B29C 70/74 (2013.01); H04M 1/185 (2013.01); H05K 5/04 (2013.01); B22F 2301/255 (2013.01); B29C 39/38 (2013.01); B29L 2031/3456 (2013.01); B29L 2031/3481 (2013.01);
Abstract
A cover plate, a method of manufacturing the cover plate, and an electronic device having the cover plate are provided. The cover plate includes a substrate, at least one slot defined in the substrate and penetrating through the substrate, and a filling layer received in the slot including an insulating layer and a gel layer located on the insulating layer.