The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10414093 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 17, 2019

Filed:

Aug. 08, 2017
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;

Inventors:

Koichi Ikeyama, Miyoshi, JP;

Naoya Era, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B29C 64/205 (2017.01); B29C 64/255 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B29C 64/153 (2017.01); B29C 64/214 (2017.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01);
U.S. Cl.
CPC ...
B29C 64/214 (2017.08); B29C 64/153 (2017.08); B29C 64/165 (2017.08); B29C 64/205 (2017.08); B29C 64/255 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

The three-dimensional molding device includes a recoater configured to discharge a granular material from a discharge port onto the molding table such that the granular material is superimposed in layer, a solidification device configured to solidify a partial region of the granular material in a plane solidification device direction of an upper surface of the molding table, a moving mechanism configured to cause the recoater to reciprocate in a plane direction parallel to the upper surface of the molding table, and at least one plug member configured to close a part of an opening in at least one location in a longitudinal direction of the discharge port of the recoater and limit a discharge range of the granular material.


Find Patent Forward Citations

Ikeyama, Koichi. (2019). Three-dimensional molding device and three-dimensional molding method (U.S. Patent No. 10414093). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10414093

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