The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Sep. 14, 2015
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Zachary J. Thompson, Woodbury, MN (US);

Yoshihiko Tasaka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 4/00 (2006.01); B05D 7/14 (2006.01); C08F 4/10 (2006.01); C08F 4/26 (2006.01); C08F 220/28 (2006.01); C08L 33/06 (2006.01); C08F 220/20 (2006.01); C08K 3/22 (2006.01); C08K 5/14 (2006.01); C08K 5/3477 (2006.01); C09D 133/14 (2006.01); C08F 220/54 (2006.01); C08F 220/18 (2006.01); C08F 220/34 (2006.01); C08F 222/10 (2006.01);
U.S. Cl.
CPC ...
B05D 7/14 (2013.01); C08F 4/00 (2013.01); C08F 4/10 (2013.01); C08F 4/26 (2013.01); C08F 220/20 (2013.01); C08F 220/28 (2013.01); C08K 3/22 (2013.01); C08K 5/14 (2013.01); C08K 5/3477 (2013.01); C08L 33/06 (2013.01); C09D 133/14 (2013.01); C08F 220/18 (2013.01); C08F 220/54 (2013.01); C08F 222/1006 (2013.01); C08F 2220/1883 (2013.01); C08F 2220/343 (2013.01); C08F 2222/1013 (2013.01); C08K 2003/2248 (2013.01);
Abstract

A method of curing a curable composition includes: providing the curable composition; providing a substrate having a primer disposed on at least a portion thereof, wherein the primer comprises at least one immobilized polyvalent metal compound for free-radically curing the curable composition; and contacting the curable composition with the primer, thereby causing at least partial curing of the curable composition. The curable composition includes at least one free-radically polymerizable compound and a beta-dicarbonyl compound. The method can be used for adhesive bonding of substrates and preparation of various articles.


Find Patent Forward Citations

Loading…