The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Jul. 18, 2016
Applicant:

Purdue Research Foundation, West Lafayette, IN (US);

Inventors:

Ho Yeung, Bethesda, MD (US);

Koushik Viswanathan, Greenwood, IN (US);

Walter Dale Compton, West Lafayette, IN (US);

Srinivasan Chandrasekar, West Lafayette, IN (US);

Assignee:

Purdue Research Foundation, West Lafayette, IN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/00 (2006.01); B23C 3/00 (2006.01); B23B 25/02 (2006.01); B23B 1/00 (2006.01);
U.S. Cl.
CPC ...
B05D 3/002 (2013.01); B23B 1/00 (2013.01); B23B 25/02 (2013.01); B05D 2202/00 (2013.01); B23B 2228/10 (2013.01); B23B 2228/24 (2013.01); B23B 2228/28 (2013.01);
Abstract

Methods of machining a body to produce a chip are provided wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body and the chip is formed primarily by laminar flow.


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