The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Oct. 05, 2016
Applicant:
Tc1 Llc, St. Paul, MN (US);
Inventors:
Samuel Schimpf, Weisslingen, CH;
Mark McChrystal, San Ramon, CA (US);
Joseph C. Stark, III, San Leandro, CA (US);
Andre Siebenhaar, Gipf-Oberfrick, CH;
Assignee:
TC1 LLC, St. Paul, MN (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61M 1/12 (2006.01); H05K 1/02 (2006.01); G01B 7/00 (2006.01); A61M 1/10 (2006.01); H05K 3/30 (2006.01); F04D 13/06 (2006.01); G01B 7/30 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); F04D 15/00 (2006.01); G01R 33/07 (2006.01); H05K 3/32 (2006.01); G01D 5/14 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
A61M 1/1086 (2013.01); A61M 1/1031 (2014.02); A61M 1/1036 (2014.02); A61M 1/12 (2013.01); A61M 1/122 (2014.02); F04D 13/064 (2013.01); F04D 15/0077 (2013.01); G01B 7/003 (2013.01); G01B 7/30 (2013.01); G01D 5/142 (2013.01); G01R 33/072 (2013.01); H05K 1/028 (2013.01); H05K 1/119 (2013.01); H05K 1/189 (2013.01); H05K 3/30 (2013.01); H05K 3/303 (2013.01); H05K 3/32 (2013.01); A61M 1/101 (2013.01); A61M 1/1012 (2014.02); A61M 1/1015 (2014.02); A61M 1/1017 (2014.02); A61M 2205/3317 (2013.01); A61M 2205/3334 (2013.01); A61M 2205/3365 (2013.01); A61M 2207/00 (2013.01); H05K 3/4691 (2013.01); H05K 2201/052 (2013.01); H05K 2201/10151 (2013.01); Y10T 29/49009 (2015.01); Y10T 29/49128 (2015.01);
Abstract
A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.