The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Jun. 08, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Eunsung Lee, Hwaseong-si, KR;

Youngil Kim, Suwon-si, KR;

Jong Keun Song, Yongin-si, KR;

Minseog Choi, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); A61B 8/14 (2006.01); G01S 7/52 (2006.01); B06B 1/02 (2006.01); G01S 15/89 (2006.01); A61B 8/08 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4494 (2013.01); B06B 1/02 (2013.01); G01S 7/5208 (2013.01); G01S 15/8915 (2013.01); A61B 8/0891 (2013.01); A61B 8/14 (2013.01); A61B 8/4444 (2013.01); B06B 2201/76 (2013.01);
Abstract

Disclosed herein is an ultrasound probe including a transducer array configured to generate ultrasonic waves, an integrated circuit disposed on a back surface of the transducer array by using an adhesive member, a printed circuit board connected to the integrated circuit and configured to output a signal to the integrated circuit, and a pad bridge disposed on front surfaces of the printed circuit board and the integrated circuit by using the adhesive member and configured to electrically connect the printed circuit board with the integrated circuit. An area of a region of the ultrasound probe contacting the human body may be reduced without reducing the size of the transducer array, and the integrated circuit and the printed circuit board may be integrally connected by using the adhesive member.


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