The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Dec. 06, 2017
Applicants:

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Hongqisheng Precision Electronics (Qinhuangdao) Co.,ltd., Qinhuangdao, CN;

Inventor:

Tzu-Chien Yeh, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/40 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4691 (2013.01); H05K 1/0278 (2013.01); H05K 1/0353 (2013.01); H05K 1/0393 (2013.01); H05K 1/115 (2013.01); H05K 3/0032 (2013.01); H05K 3/0064 (2013.01); H05K 3/4038 (2013.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract

A FPCB includes a base layer defining at least one first through hole. A conductive paste block is formed in each first through hole. Each conductive paste block includes a first and a second end portion. The base layer has opposite surfaces, and a first conductive wiring layer is formed on each surface of the base layer. The first end portion at least protrudes from the base layer and is exposed from the first conductive wiring layer. An insulating layer and a second conductive wiring layer are formed on each first conductive wiring layer. At least one second through hole is defined in each insulating layer. The second through hole positioned near the first end portion extends to the first end portion and forms a recess. A conductive via is formed in each second through hole and the corresponding recess, and is electrically connected to the conductive paste block.


Find Patent Forward Citations

Yeh, Tzu-Chien. (2019). Flexible printed circuit board and method for manufacturing the same (U.S. Patent No. 10412841). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10412841

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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