The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2019
Filed:
May. 01, 2017
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Arata Kishi, Fukuoka, JP;
Hiroki Maruo, Fukuoka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); C22C 12/00 (2006.01); C22C 28/00 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3468 (2013.01); B23K 1/0016 (2013.01); B23K 35/264 (2013.01); C22C 12/00 (2013.01); C22C 28/00 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/3478 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/1339 (2013.01); H01L 2224/13309 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13313 (2013.01); H01L 2224/13318 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/20104 (2013.01); H05K 2201/10234 (2013.01); H05K 2203/041 (2013.01);
Abstract
There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.