The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2019
Filed:
Sep. 29, 2018
Qing Ding Precision Electronics (Huaian) Co.,ltd, Huai an, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Tzu-Chien Yeh, New Taipei, TW;
Lin-Jie Gao, Huaian, CN;
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Abstract
A rigid-flex circuit board includes a core substrate, a first outer conductive circuit layer, and a second outer conductive circuit layer. The core substrate includes a first base layer and a second base layer. A first conductive circuit layer is formed on a surface of the first base layer, and a second conductive circuit layer is formed on a surface of the second base layer. An insulating layer is located between the first base layer and the second base layer. The first conductive circuit layer and the second conductive circuit layer are embedded within the insulating layer. A portion of the core substrate located within the first opening and the second opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening and the second opening are defined as a hard board section.