The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2019
Filed:
Aug. 17, 2017
Applicant:
Nikon Corporation, Tokyo, JP;
Inventors:
Ryoichi Suganuma, Yokohama, JP;
Hirofumi Arima, Tokyo, JP;
Satoru Suzuki, Yokohama, JP;
Takuya Sato, Tokyo, JP;
Assignee:
NIKON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H04N 5/225 (2006.01); H05K 1/05 (2006.01); H05K 3/46 (2006.01); H01L 27/146 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/44 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H04N 5/2253 (2013.01); H05K 1/0283 (2013.01); H05K 1/05 (2013.01); H05K 1/056 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/4608 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/16195 (2013.01); H05K 1/0206 (2013.01); H05K 1/0366 (2013.01); H05K 3/445 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10121 (2013.01);
Abstract
A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.