The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Oct. 29, 2018
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Saquib Bin Halim, Saxony, DE;

MD Sayed Kaysar Bin Rahim, Mechanicville, NY (US);

Marcel Wieland, Saxony, DE;

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/38 (2015.01); H04B 1/40 (2015.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H04B 1/40 (2013.01); H01L 21/56 (2013.01); H01L 21/76898 (2013.01); H01L 23/3135 (2013.01); H01L 23/481 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 23/3128 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A semiconductor device comprising an on-mold antenna for transmitting and/or receiving a millimeter-wave radio frequency signal is provided. The semiconductor device includes a semiconductor layer; a polymer layer proximal to the semiconductor layer; a mold proximal to the polymer layer; a plurality of nodes proximal to the semiconductor layer and distal to the polymer layer; an antenna disposed on the mold; and a conductive element providing electrical communication between the antenna and a first node. The mold may be from 500 μm to 1000 μm thick, such as from 750 μm to 800 μm thick, such as about 775 μm.


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