The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Nov. 03, 2017
Applicant:

Lapis Semiconductor Co., Ltd., Yokohama, JP;

Inventors:

Kazuya Yamada, Yokohama, JP;

Toshihisa Sone, Yokohama, JP;

Akihiro Takei, Yokohama, JP;

Yuichi Yoshida, Miyazaki, JP;

Kengo Takemasa, Miyazaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/44 (2006.01); H03L 1/02 (2006.01); G01R 21/00 (2006.01); H03L 1/04 (2006.01); G01R 35/04 (2006.01); G01R 22/10 (2006.01); H03K 3/011 (2006.01); G01R 22/06 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H03L 1/026 (2013.01); G01R 1/44 (2013.01); G01R 21/00 (2013.01); G01R 22/061 (2013.01); G01R 22/10 (2013.01); G01R 35/04 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H03K 3/011 (2013.01); H03L 1/02 (2013.01); H03L 1/027 (2013.01); H03L 1/04 (2013.01); H01L 24/49 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.


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