The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2019
Filed:
Sep. 10, 2018
Applicant:
Toshiba Memory Corporation, Minato-ku, JP;
Inventors:
Akinobu Hirota, Yokohama, JP;
Shiro Harashima, Sagamihara, JP;
Assignee:
Toshiba Memory Corporation, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01R 27/00 (2006.01); H05K 5/00 (2006.01); H05K 1/18 (2006.01); H05K 5/04 (2006.01); H01R 12/71 (2011.01); H01R 13/502 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H01R 27/00 (2013.01); H01R 12/716 (2013.01); H01R 13/5025 (2013.01); H05K 1/181 (2013.01); H05K 5/0026 (2013.01); H05K 5/0247 (2013.01); H05K 5/04 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10522 (2013.01);
Abstract
According to one embodiment, a semiconductor memory device includes a casing, a substrate, a second connector, and an interposition member. The casing is provided with a first opening and includes a first edge forming the first opening. A first connector conforms to USB Type-A standard and can pass through the first opening. The interposition member is interposed between an inner surface of the casing and the second connector, is held by the inner surface, and holds the second connector.