The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Mar. 20, 2017
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Daniel C. Wagman, Los Gatos, CA (US);

Benjamin J. Kallman, Menlo Park, CA (US);

Hani Esmaeili, Sunnyvale, CA (US);

Stefan A. Kowalski, San Jose, CA (US);

Daniel T. McDonald, Cupertino, CA (US);

Eric S. Jol, San Jose, CA (US);

Raymund W. M. Kwok, Hong Kong, HK;

Michael W. Barnstead, Pleasanton, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/02 (2006.01); H01R 13/03 (2006.01); H01R 13/40 (2006.01); B32B 15/00 (2006.01); C22C 5/00 (2006.01); C22C 5/02 (2006.01); C22C 5/04 (2006.01); C22C 9/00 (2006.01); C22C 9/02 (2006.01); C22C 9/04 (2006.01); C22C 9/06 (2006.01); H01R 24/60 (2011.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); B32B 15/00 (2013.01); C22C 5/00 (2013.01); C22C 5/02 (2013.01); C22C 5/04 (2013.01); C22C 9/00 (2013.01); C22C 9/02 (2013.01); C22C 9/04 (2013.01); C22C 9/06 (2013.01); H01R 13/40 (2013.01); H01R 24/60 (2013.01);
Abstract

Contacts that may be highly corrosion resistant, may be readily manufactured, and may conserve precious materials. One example may provide contacts having a layer of a precious-metal alloy to improve corrosion resistance. The precious-metal-alloy layer may be plated with a hard, durable, wear and corrosion resistant plating stack for further corrosion resistance and wear improvement. The resources consumed by a contact may be reduced by forming a bulk or substrate region of the contact using a more readily available material, such as copper or a material that is primarily copper based.


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