The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

May. 30, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Shigeki Nishiyama, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01G 4/33 (2006.01); H01L 25/00 (2006.01); H01G 4/06 (2006.01);
U.S. Cl.
CPC ...
H01L 28/90 (2013.01); H01G 4/06 (2013.01); H01G 4/33 (2013.01); H01L 25/00 (2013.01);
Abstract

A semiconductor capacitor includes a semiconductor substrate having a first and second principal surfaces. A first set of one or more trenches is formed on the first principal surface and a second set of one or more trenches formed on the second principal surface. A first dielectric film is located on the first principal surface and least inner walls of the first set of one or more trenches. A second dielectric film is located on the second principal surface and least inner walls of the second set of one or more trenches. A first conductor film located on the first dielectric film. A second conductor film located on the second dielectric film. The semiconductor substrate is formed of Si, SiC, GaN, or the like. The dielectric film has a two-layer structure of SiOand SiN.


Find Patent Forward Citations

Loading…