The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Mar. 20, 2015
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Richard Scott Burton, Phoenix, AZ (US);

Karel Ptacek, Roznov Pod Radhostem, CZ;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 27/0805 (2013.01);
Abstract

In accordance with an embodiment, a method of manufacturing an electrical component that may include a high voltage capacitor that includes providing a semiconductor material of a second conductivity type in which first doped region of a first conductivity type is formed. A plurality of doped regions of the first conductivity type and a plurality of doped regions of the second conductivity type are formed in the first doped region. A first p-n junction is formed between first doped regions of the first and second conductivity types and a second p-n junction is formed between second doped regions of the first and second conductivity types. A metallization system is formed above the doped regions so that capacitors are formed by a parallel connection of a first metal layer to a polysilicon layer and the first metal layer to a second metal layer.


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