The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Jan. 06, 2015
Applicant:

Mc10, Inc., Lexington, MA (US);

Inventors:

Nicholas McMahon, Bolton, MA (US);

Xianyan Wang, San Jose, CA (US);

Brian Elolampi, Belmont, MA (US);

Bryan D. Keen, Somerville, MA (US);

David G. Garlock, Derry, NH (US);

Assignee:

MC10, Inc., Lexington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 13/86 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 21/0206 (2013.01); H01L 21/4864 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 22/20 (2013.01); H01L 23/293 (2013.01); H01L 23/296 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 23/562 (2013.01); H01H 13/86 (2013.01); H01L 23/5387 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.


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