The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Jul. 20, 2017
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventor:

Taijiro Momose, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/28 (2006.01); H01L 23/488 (2006.01); H01L 23/367 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 23/28 (2013.01); H01L 23/3675 (2013.01); H01L 23/488 (2013.01); H01L 25/072 (2013.01);
Abstract

A power conversion device includes a semiconductor module with switching elements incorporated therein, a plurality of components electrically connected to the semiconductor module, and a laminated cooler provided with a plurality of cooling plates. A laminate is constituted by laminating at least the plurality of cooling plates and the semiconductor module, at least one among the plurality of cooling plates constituting the laminate is a large area cooling plate in which a projected area when viewed from the stacking direction is larger than the other cooling plates, and at least one of the components is a specific arrangement component which, when viewed from the stacking direction, is arranged in a specific position which overlaps the large area cooling plate, and, when viewed from a direction orthogonal to the stacking direction, overlaps with the laminate.


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