The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Jan. 30, 2015
Applicant:

Netgear, Inc., San Jose, CA (US);

Inventors:

John Ramones, San Ramon, CA (US);

Arun Raghupathy, Sunnyvale, CA (US);

Assignee:

Netgear, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/467 (2006.01); H01L 23/552 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 21/4882 (2013.01); H01L 23/552 (2013.01); H01L 23/467 (2013.01);
Abstract

A heat sink and an EMI shield are integrated via injection molding. The heat sink and the EMI shield may be molded together as an integrated unit with an intervening non-electrically conductive layer formed between the heat sink and the EMI shield during the injection molding process. The integrated molded unit could also be molded to a thermally conductive layer comprising another material such as an elastomer suitable for more precisely conforming to the contours of an electrical component for maximizing thermal transfer. Accordingly, the number of steps and amount of materials required to provide thermal dissipation and EMI protection for an electrical component may be reduced.


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