The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Oct. 07, 2014
Applicant:

Europlasma NV, Oudenaarde, BE;

Inventors:

Filip Legein, Oudenaarde, BE;

Eva Rogge, Oudenaarde, BE;

Marc Sercu, Oudenaarde, BE;

Assignee:

Europlasma NV, Oudenaarde, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); B05D 7/02 (2006.01); B05D 5/08 (2006.01); C03C 17/32 (2006.01); C23C 16/50 (2006.01); B05D 7/14 (2006.01); C04B 41/00 (2006.01); C04B 41/45 (2006.01); C04B 41/83 (2006.01); C09D 133/16 (2006.01); C23C 26/00 (2006.01); D21H 23/22 (2006.01); B05D 1/00 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32146 (2013.01); B05D 5/08 (2013.01); B05D 7/02 (2013.01); B05D 7/14 (2013.01); C03C 17/32 (2013.01); C04B 41/009 (2013.01); C04B 41/4523 (2013.01); C04B 41/83 (2013.01); C09D 133/16 (2013.01); C23C 16/50 (2013.01); C23C 26/00 (2013.01); D21H 23/22 (2013.01); B05D 1/62 (2013.01); C03C 2217/20 (2013.01); C03C 2217/76 (2013.01); C03C 2218/15 (2013.01); H01J 2237/327 (2013.01); H01J 2237/3326 (2013.01);
Abstract

The present invention concerns a method comprising the steps of: introducing a substrate comprising a surface to be coated in a low-pressure reaction chamber; exposing said surface to a plasma during a treatment period within said reaction chamber; ensuring a stable plasma ignition by applying a power input, characterized in that the power input is continuously strictly higher than zero Watt (W) during said treatment period and comprises at least a lower limit power and at least an upper limit power strictly larger than said lower limit power, thereby obtaining a substrate with a coated surface. The present invention further concerns an apparatus for treating a substrate with a low-pressure plasma process and a substrate treated as such.


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