The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2019
Filed:
Nov. 11, 2016
Beijing University of Technology, Beijing, CN;
Xiaodong Han, Beijing, CN;
Zhipeng Li, Beijing, CN;
Shengcheng Mao, Beijing, CN;
Xiaodong Wang, Beijing, CN;
Chunqiang Zhuang, Beijing, CN;
Jianfei Zhang, Beijing, CN;
Qingsong Deng, Beijing, CN;
Yadi Zhai, Beijing, CN;
Taonan Zhang, Beijing, CN;
Ze Zhang, Beijing, CN;
BEIJING UNIVERSITY OF TECHNOLOGY, Beijing, CN;
Abstract
A double-tilt in-situ nanoindentation platform for TEM (transmission electron microscope) belongs to the field of in-situ characterization of the mechanical property-microstructure relationship of materials at the nano- and atomic scale. The platform is consisted of adhesive area, support beams, bearing beams, sample loading stage and mini indenter. The overall structure of the platform is prepared by semiconductor microfabrication technology. The in-situ nanoindentation experiment can be driven by bimetallic strip, V-shaped electro-thermal beam, piezoelectric ceramics, electrostatic comb or shape memory alloys et. al. The sample is obtained by focused ion beam cutting. The integrated platform can be placed in the narrow space on the front end of the TEM sample holder, giving rise to the condition of double-axis tilt. The driving device drives the mini indenter to carry out in-situ nanoindentation, in-situ compression and in-situ bending and the like of the materials in TEM. The deformation process of material can be in-situ observed in sub angstrom, atomic and nano scale to study the deformation mechanism of material, which can further reveal the relationship of microstructure-mechanical properties of the material.