The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Jun. 27, 2016
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Jay R. Neumann, Goleta, CA (US);

Thomas F. McEwan, Ventura, CA (US);

David E. Sigurdson, Goleta, CA (US);

Alberto Perez, Santa Paula, CA (US);

Janine F. Lambe, Goleta, CA (US);

Gregory D. Tracy, Buellton, CA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/04 (2006.01); H05K 5/00 (2006.01); H05K 1/02 (2006.01); H01R 12/79 (2011.01); H01L 27/146 (2006.01); G06F 13/20 (2006.01); H01P 3/08 (2006.01); H04N 5/225 (2006.01); H05K 3/46 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H01B 7/04 (2013.01); G06F 13/20 (2013.01); H01L 27/14636 (2013.01); H01L 27/14652 (2013.01); H01P 3/08 (2013.01); H01R 12/79 (2013.01); H04M 1/0264 (2013.01); H04N 5/2253 (2013.01); H05K 1/0284 (2013.01); H05K 3/4691 (2013.01); H05K 5/0069 (2013.01); H05K 1/0203 (2013.01); H05K 1/0243 (2013.01); H05K 1/0245 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10189 (2013.01); Y02D 10/14 (2018.01);
Abstract

A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.


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