The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Jul. 27, 2018
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Ygal Arbel, Morgan Hill, CA (US);

Sagheer Ahmad, Cupertino, CA (US);

Balakrishna Jayadev, San Jose, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); G06F 11/10 (2006.01); G06F 3/06 (2006.01);
U.S. Cl.
CPC ...
G11C 7/1096 (2013.01); G06F 3/061 (2013.01); G06F 3/0629 (2013.01); G06F 3/0658 (2013.01); G06F 11/1044 (2013.01); G11C 7/1069 (2013.01);
Abstract

Techniques related to a high bandwidth interface (HBI) for communication between multiple host devices on an interposer are described. In an example, the HBI repurposes a portion of the high bandwidth memory (HBM) interface, such as the physical layer. A computing system is provided. The computing system includes a first host device and at least a second host device. The first host device is a first die on an interposer and the second host device is a second die on the interposer. The first host device and the second host device are interconnected via at least one HBI. The HBI implements a layered protocol for communication between the first host device and the second host device. The layered protocol includes a physical layer protocol that is configured according to a HBM physical layer protocol.


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