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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10409164 B1

PDFFull Text
Date of Patent:
Sep. 10, 2019

Filed:

Jul. 03, 2018

Heat-reactive resist material, mold manufacturing method, mold, development method and pattern formation material

Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yoshimichi Mitamura, Tokyo, JP;

Takuto Nakata, Tokyo, JP;

Assignee:

ASAHI KASEI KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Timothy Kennedy

Assistant Examiner:

John Robitaille

Int. Cl.
CPC ...
B29C 33/38 (2006.01); G03F 7/38 (2006.01); G03F 7/00 (2006.01); B29C 59/02 (2006.01); C04B 35/45 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/004 (2006.01); G03F 7/32 (2006.01); G11B 7/26 (2006.01); B29C 33/42 (2006.01); G11B 7/14 (2012.01);
U.S. Cl.
CPC ...
G03F 7/38 (2013.01); B29C 33/3857 (2013.01); B29C 59/022 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); C04B 35/45 (2013.01); G03F 7/0002 (2013.01); G03F 7/0043 (2013.01); G03F 7/32 (2013.01); G03F 7/322 (2013.01); G11B 7/261 (2013.01); B29C 33/424 (2013.01); B29C 2059/023 (2013.01); G03F 7/0017 (2013.01); G11B 7/14 (2013.01);
Abstract

A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol % or more less than 10.0 mol % in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a fluorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape.

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