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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10409163 B1

PDFFull Text
Date of Patent:
Sep. 10, 2019

Filed:

Sep. 18, 2015

Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yugo Tanigaki, Otsu, JP;

Takenori Fujiwara, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch LLP

Primary Examiner:

Kuo Liang Peng

Int. Cl.
CPC ...
G03F 7/095 (2006.01); C08K 3/36 (2006.01); C08K 5/28 (2006.01); C08L 83/06 (2006.01); G03F 7/40 (2006.01); H01L 21/027 (2006.01); H01L 21/3065 (2006.01); G03F 7/004 (2006.01); G03F 7/039 (2006.01); G03F 7/023 (2006.01); G03F 7/032 (2006.01); G03F 7/075 (2006.01);
U.S. Cl.
CPC ...
G03F 7/095 (2013.01); C08K 3/36 (2013.01); C08K 5/28 (2013.01); C08L 83/06 (2013.01); G03F 7/0042 (2013.01); G03F 7/0047 (2013.01); G03F 7/0233 (2013.01); G03F 7/032 (2013.01); G03F 7/039 (2013.01); G03F 7/0758 (2013.01); G03F 7/40 (2013.01); H01L 21/027 (2013.01); H01L 21/3065 (2013.01);
Abstract

To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).

Find Patent Forward Citations

Tanigaki, Yugo. (2019). Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device (U.S. Patent No. 10409163). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10409163

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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