The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Jun. 02, 2014
Applicant:

Uacj Corporation, Tokyo, JP;

Inventors:

Takashi Murase, Tokyo, JP;

Kotaro Kitawaki, Tokyo, JP;

Tomohito Kurosaki, Tokyo, JP;

Junji Ninomiya, Tokyo, JP;

Assignee:

UACJ Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 21/08 (2006.01); C22C 21/00 (2006.01); C22F 1/043 (2006.01); F28F 19/06 (2006.01); B22D 11/00 (2006.01); B22D 11/06 (2006.01); C22C 21/02 (2006.01); F28F 1/10 (2006.01); F28F 1/12 (2006.01);
U.S. Cl.
CPC ...
F28F 21/084 (2013.01); B22D 11/003 (2013.01); B22D 11/0622 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); C22F 1/043 (2013.01); F28F 1/10 (2013.01); F28F 19/06 (2013.01); F28F 1/12 (2013.01);
Abstract

There is provided a heat exchanger and a fin material for the heat exchanger that can suppress occurrence of hollow corrosion in a fin and hold cooling performance for a long period of time under a high corrosion environment. The heat exchanger includes an aluminum tube through which a working fluid circulates and an aluminum fin which is bonded to the tube. The fin has a region B around a grain boundary, and a region A around the region B. In the region B, 5.0×10pieces/mmless of Al—Fe—Mn—Si based intermetallic compound, each of which has equivalent circle diameters of 0.1 to 2.5 μm, are present. In the region A, 5.0×10pieces/mmto 1.0×10pieces/mmof Al—Fe—Mn—Si based intermetallic compound, each of which has equivalent circle diameters of 0.1 to 2.5 μm, are present.


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