The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2019
Filed:
Nov. 30, 2012
Daisuke Shimamoto, Tokyo, JP;
Yuji Motomura, Tokyo, JP;
Osamu Morimoto, Tokyo, JP;
Takayoshi Honda, Tokyo, JP;
Koji Nishioka, Tokyo, JP;
Tatsuo Ono, Tokyo, JP;
Daisuke Shimamoto, Tokyo, JP;
Yuji Motomura, Tokyo, JP;
Osamu Morimoto, Tokyo, JP;
Takayoshi Honda, Tokyo, JP;
Koji Nishioka, Tokyo, JP;
Tatsuo Ono, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An air conditioning apparatus includes a refrigerant circuit in which a compressor for compressing heat source-side refrigerant, a first refrigerant channel switching device, a heat source side heat exchanger, an expansion device, and intermediate heat exchangers for performing heat exchange between the heat source-side refrigerant and a heat medium different from the heat source-side refrigerant are connected by pipes. Also, the air conditioning apparatus includes a heat medium circuit in which pumps for circulating the heat medium to be used for the heat exchange performed by the intermediate heat exchangers, a use-side heat exchanger, and channel switching devices for switching passages of the heat medium heated or cooled to the use-side heat exchanger are connected by pipes. The heat medium circuit includes a strainer configured to capture foreign matter contained in the heat medium; and a heat medium relay unit control device configured to perform an operation that causes the strainer to capture foreign matter contained in the heat medium circuit during construction of the heat medium circuit.