The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Aug. 14, 2018
Applicant:

Cordelia Lighting Inc., Rancho Dominguez, CA (US);

Inventors:

Aaron O'Brien, Los Alamitos, CA (US);

Seth Chang, Rowland Heights, CA (US);

Huan C. Nguyen, Anaheim, CA (US);

Assignee:

CORDELIA LIGHTING INC., Rancho Dominguez, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/70 (2015.01); F21V 29/89 (2015.01); F21V 23/00 (2015.01); F21V 7/04 (2006.01); F21V 13/04 (2006.01); F21S 8/02 (2006.01); H05B 33/08 (2006.01); F21V 33/00 (2006.01); F21V 17/16 (2006.01); F21V 21/04 (2006.01); F21V 23/04 (2006.01); F21K 9/20 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/70 (2015.01); F21K 9/20 (2016.08); F21S 8/026 (2013.01); F21V 7/04 (2013.01); F21V 13/04 (2013.01); F21V 17/16 (2013.01); F21V 21/04 (2013.01); F21V 23/009 (2013.01); F21V 23/0435 (2013.01); F21V 29/89 (2015.01); F21V 33/0052 (2013.01); H05B 33/0803 (2013.01); F21Y 2115/10 (2016.08);
Abstract

A recessed LED light fixture without need for a bulky, finned, metal heat sink. The recessed LED light fixture includes a Metal Core Printed Circuit Board (MCPCB) holding an array of LEDs that are arrange at the center thereof, and mounted to the printed circuit board using patterns of electrical and greases used to conduct a current and radiate heat. A mounting bracket holds the entire assembly for the light fixture together while spacing the LED driver and printed circuit board apart for further cooling, and wherein the upper side of the printed circuit board is exposed to the ambient air inside the housing.


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