The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Dec. 22, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Qianwen Chen, Ossining, NY (US);

Bing Dang, Chappaqua, NY (US);

Yu Luo, Hopewell Junction, NY (US);

Joana Sofia Branquinho Teresa Maria, New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); C25D 7/04 (2006.01); H01L 21/288 (2006.01); B23K 35/26 (2006.01); C25D 17/12 (2006.01); C25D 3/60 (2006.01); C25D 3/30 (2006.01); C25D 3/54 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
C25D 7/04 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); C25D 3/30 (2013.01); C25D 3/54 (2013.01); C25D 3/60 (2013.01); C25D 5/02 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); C25D 17/12 (2013.01); H01L 21/2885 (2013.01); H01L 23/147 (2013.01);
Abstract

A method provides a structure that includes a substrate having a metal layer disposed on a surface and a metal feature disposed on the metal layer. The method further includes immersing the structure in a plating bath contained in an electroplating cell, the plating bath containing a selected solder material; applying a voltage potential to the structure, where the structure functions as a working electrode in combination with a reference electrode and a counter electrode that are also immersed in the plating bath; and maintaining the voltage potential at a predetermined value to deposit the selected solder material selectively only on the metal feature and not on the metal layer. An apparatus configured to practice the method is also disclosed.


Find Patent Forward Citations

Loading…