The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Mar. 31, 2018
Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventors:

Shuji Okazaki, Kanagawa, JP;

Katsutaka Muranaka, Kanagawa, JP;

Assignee:

Sodick Co., Lyd., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); B22F 3/105 (2006.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B33Y 30/00 (2014.12); B22F 2003/1056 (2013.01); Y02P 10/295 (2015.11);
Abstract

A heat source isolation mechanism of the laminate molding device includes an intermediate table that is mounted on an upper surface of a main table, an auxiliary table which is provided on an upper surface of the intermediate table and of which a temperature can be adjusted, and a bellows member in which the auxiliary table is disposed and which includes a lower end that is provided on the intermediate table and an upper end that is mounted on the peripheral wall, and which expands as the main table is lowered. The bellows member is made of an insulating material. The recoater head supplies a metal material powder to a molding area inside the bellows member and a powder layer is formed on the auxiliary table, a laser emission unit emits a laser beam to a predetermined area of the powder layer and sintering is performed.


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