The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Feb. 03, 2016
Applicant:

Siemens Medical Solutions Usa, Inc., Malvern, PA (US);

Inventors:

Lex J. Garbini, El Granada, CA (US);

Walter T. Wilser, Cupertino, CA (US);

Stephen R. Barnes, Bellevue, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 31/00 (2006.01); A61B 8/00 (2006.01); A61B 8/12 (2006.01); A61B 8/08 (2006.01); B06B 1/06 (2006.01); G01S 7/52 (2006.01); G01S 15/89 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4494 (2013.01); A61B 8/12 (2013.01); A61B 8/445 (2013.01); A61B 8/483 (2013.01); B06B 1/0622 (2013.01); G01S 7/52079 (2013.01); G01S 15/8929 (2013.01); A61B 8/4488 (2013.01); A61B 2562/12 (2013.01); G01S 15/8993 (2013.01); Y10T 29/49908 (2015.01);
Abstract

A memory alloy is used during manufacture of a transducer. The memory of the alloy may correct for deviations or bending during manufacture, such as a superelastic alloy returning an array to a flat state after being twisted during handling. The memory of the alloy may cause a desired change in array geometry during manufacture, such as a shape memory alloy twisting an array into a curved or helix due to applied heat. The array may be fixed in place by the memory alloy or bonding after positioning by the memory alloy, preventing further substantial alteration.


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