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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10405434 B1

PDFFull Text
Date of Patent:
Sep. 03, 2019

Filed:

Aug. 08, 2017

Mounting jig for semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Rikihiro Maruyama, Matsumoto, JP;

Kenshi Kai, Matsumoto, JP;

Nobuyuki Kanzawa, Matsumoto, JP;

Mitsutoshi Sawano, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Minh N Trinh

Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01L 21/48 (2006.01); H01L 25/07 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H01L 23/373 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/301 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 25/072 (2013.01); H05K 3/303 (2013.01); H05K 3/341 (2013.01); H01L 23/3735 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H05K 3/4015 (2013.01); H05K 2201/1031 (2013.01); H05K 2201/10257 (2013.01); H05K 2203/0278 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11); Y10T 29/532 (2015.01);
Abstract

A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.

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