The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Jul. 02, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takuya Shimomugi, Tokyo, JP;

Koichi Arisawa, Tokyo, JP;

Takashi Yamakawa, Tokyo, JP;

Keisuke Uemura, Tokyo, JP;

Noriyuki Matsubara, Tokyo, JP;

Shinsaku Kusube, Tokyo, JP;

Kenta Yuasa, Tokyo, JP;

Akihiro Tsumura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02P 6/28 (2016.01); H02M 3/158 (2006.01); F24F 7/007 (2006.01); F25B 31/02 (2006.01); H02M 1/34 (2007.01); H02P 27/06 (2006.01); H02M 1/00 (2006.01); H02M 1/42 (2007.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H02P 6/28 (2016.02); F24F 7/007 (2013.01); F25B 31/02 (2013.01); H02M 1/34 (2013.01); H02M 3/158 (2013.01); H02P 27/06 (2013.01); H02M 1/4225 (2013.01); H02M 7/003 (2013.01); H02M 2001/0051 (2013.01); H02M 2001/342 (2013.01); Y02B 70/126 (2013.01); Y02B 70/1491 (2013.01);
Abstract

A backflow preventing device includes a backflow preventing element that is connected between a power supply and a load and that prevents electric current from flowing backward from the load side toward the power supply side, and a commutating device that performs a commutation operation for causing the electric current to flow to a commutation path connected in parallel with the backflow preventing element. A plurality of elements including at least one or more of elements constituting the commutating device are configured as a module, so that, for example, the device can be reduced in size. Moreover, a simplified heat-dissipation design and a simplified air-duct design can be achieved.


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